Name: Storage & Server IO (Amphenol ICC) DILB18P-223TLF
Brand: Storage & Server IO (Amphenol ICC)
SKU: DILB18P-223TLF
Price: 0.35000 USD
Availability: InStock

Technical Specifications

Series	DILB
Package	Tube
Part Status	Active
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin-Lead
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Post	100.0µin (2.54µm)
Contact Material - Post	Copper Alloy
Housing Material	Polyamide (PA), Nylon
Operating Temperature	-55°C ~ 125°C

Product Description

The Storage & Server IO (Amphenol ICC) DILB18P-223TLF is a CONN IC DIP SOCKET 18POS TINLEAD. This component belongs to the Sockets for ICs, Transistors category and features Package of Tube, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Storage & Server IO (Amphenol ICC) components with competitive pricing and fast delivery worldwide.

Key Specifications

Package: Tube
Mounting Type: Through Hole

Whether you need the Storage & Server IO (Amphenol ICC) DILB18P-223TLF for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.