Storage & Server IO (Amphenol ICC) DILB32P-223TLF

CONN IC DIP SOCKET 32POS TINLEAD

In Stock: 20,000 Genuine Part Fast Shipping
Storage & Server IO (Amphenol ICC) DILB32P-223TLF
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Key Specifications

Series DILB
Package Tube
Part Status Active
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 32 (2 x 16)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin-Lead
Contact Finish Thickness - Mating 100.0µin (2.54µm)

Pricing

Quantity Unit Price (USD)
1+ $0.5000
10+ $0.4646
25+ $0.4183
50+ $0.3721
100+ $0.3565
250+ $0.3255
500+ $0.3100
1,000+ $0.2557
2,500+ $0.2325
Active RoHS Compliant

Quick inquiry

Genuine
Fast Ship
Support

Technical Specifications

Series DILB
Package Tube
Part Status Active
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 32 (2 x 16)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin-Lead
Contact Finish Thickness - Mating 100.0µin (2.54µm)
Contact Material - Mating Copper Alloy
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin-Lead
Contact Finish Thickness - Post 100.0µin (2.54µm)
Contact Material - Post Copper Alloy
Housing Material Polyamide (PA), Nylon
Operating Temperature -55°C ~ 125°C

Product Description

The Storage & Server IO (Amphenol ICC) DILB32P-223TLF is a CONN IC DIP SOCKET 32POS TINLEAD. This component belongs to the Sockets for ICs, Transistors category and features Package of Tube, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Storage & Server IO (Amphenol ICC) components with competitive pricing and fast delivery worldwide.

Key Specifications

  • Package: Tube
  • Mounting Type: Through Hole

Whether you need the Storage & Server IO (Amphenol ICC) DILB32P-223TLF for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.

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