Name: Aries Electronics, Inc. 225-PLS18003-12
Brand: Aries Electronics, Inc.
SKU: 225-PLS18003-12
Price: 96.66000 USD
Availability: InStock

Technical Specifications

Series	PLS
Package	-
Part Status	Active
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	225 (15 x 15)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS)
Operating Temperature	-

Product Description

The Aries Electronics, Inc. 225-PLS18003-12 is a ZIF PGA SOCKET 225 PIN 18 X 18. This component belongs to the Sockets for ICs, Transistors category and features Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Aries Electronics, Inc. components with competitive pricing and fast delivery worldwide.

Key Specifications

Mounting Type: Through Hole

Whether you need the Aries Electronics, Inc. 225-PLS18003-12 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.