Aries Electronics, Inc. 24-3575-11

CONN IC DIP SOCKET ZIF 24POS TIN

In Stock: 12,576 Genuine Part Fast Shipping
Aries Electronics, Inc. 24-3575-11
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Key Specifications

Series 57
Package Bulk
Part Status Active
Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 200.0µin (5.08µm)

Pricing

Quantity Unit Price (USD)
1+ $19.4030
10+ $19.4030
Active RoHS Compliant

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Genuine
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Technical Specifications

Series 57
Package Bulk
Part Status Active
Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 200.0µin (5.08µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200.0µin (5.08µm)
Contact Material - Post Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -

Product Description

The Aries Electronics, Inc. 24-3575-11 is a CONN IC DIP SOCKET ZIF 24POS TIN. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Aries Electronics, Inc. components with competitive pricing and fast delivery worldwide.

Key Specifications

  • Package: Bulk
  • Mounting Type: Through Hole

Whether you need the Aries Electronics, Inc. 24-3575-11 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.

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