Aries Electronics, Inc. 28-3574-18

CONN IC DIP SOCKET ZIF 28POS GLD

In Stock: 10,523 Genuine Part Fast Shipping
Aries Electronics, Inc. 28-3574-18
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Key Specifications

Series 57
Package Bulk
Part Status Active
Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)

Pricing

Quantity Unit Price (USD)
1+ $95.6000
11+ $80.6627
Active RoHS Compliant

Quick inquiry

Genuine
Fast Ship
Support

Technical Specifications

Series 57
Package Bulk
Part Status Active
Type DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 28 (2 x 14)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -

Product Description

The Aries Electronics, Inc. 28-3574-18 is a CONN IC DIP SOCKET ZIF 28POS GLD. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Aries Electronics, Inc. components with competitive pricing and fast delivery worldwide.

Key Specifications

  • Package: Bulk
  • Mounting Type: Through Hole

Whether you need the Aries Electronics, Inc. 28-3574-18 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.

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