Name: Aries Electronics, Inc. 44-6554-18
Brand: Aries Electronics, Inc.
SKU: 44-6554-18
Price: 121.97571 USD
Availability: InStock

Technical Specifications

Series	55
Package	Bulk
Part Status	Active
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	44 (2 x 22)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Nickel Boron
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Contact Material - Mating	Beryllium Nickel
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Post	50.0µin (1.27µm)
Contact Material - Post	Beryllium Nickel
Housing Material	Polyetheretherketone (PEEK), Glass Filled
Operating Temperature	-55°C ~ 250°C

Product Description

The Aries Electronics, Inc. 44-6554-18 is a CONN IC DIP SOCKET ZIF 44POS. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Aries Electronics, Inc. components with competitive pricing and fast delivery worldwide.

Key Specifications

Package: Bulk
Mounting Type: Through Hole

Whether you need the Aries Electronics, Inc. 44-6554-18 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.