RF EMI LIQUID FIP THERM CURE
| Series | CHOFORM® 5560 |
| Package | Bulk |
| Part Status | Active |
| Type | Liquid |
| Shape | - |
| Length | - |
| Width | - |
| Thickness - Overall | - |
| Quantity | Unit Price (USD) |
|---|---|
| 1+ | $547.4300 |
| Series | CHOFORM® 5560 |
| Package | Bulk |
| Part Status | Active |
| Type | Liquid |
| Shape | - |
| Length | - |
| Width | - |
| Thickness - Overall | - |
| Operating Temperature | 150°C |
| Adhesive | Self-Adhesive |
| Material | Silicone Elastomer |
The Parker Chomerics 19-26-5560-0500 is a RF EMI LIQUID FIP THERM CURE. This component belongs to the RFI and EMI - Shielding and Absorbing Materials category and features Package of Bulk. As an authorized distributor, SecureChip offers genuine Parker Chomerics components with competitive pricing and fast delivery worldwide.
Whether you need the Parker Chomerics 19-26-5560-0500 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.