Name: Preci-Dip 514-83-360M19-001148
Brand: Preci-Dip
SKU: 514-83-360M19-001148
Price: 32.12300 USD
Availability: InStock

Technical Specifications

Series	514
Package	Bulk
Part Status	Active
Type	BGA
Number of Positions or Pins (Grid)	360 (19 x 19)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	29.5µin (0.75µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Surface Mount
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C

Product Description

The Preci-Dip 514-83-360M19-001148 is a CONN SOCKET BGA 360POS GOLD. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Surface Mount. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.

Key Specifications

Package: Bulk
Mounting Type: Surface Mount

Whether you need the Preci-Dip 514-83-360M19-001148 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.