Preci-Dip 514-87-360M19-001148

CONN SOCKET BGA 360POS GOLD

In Stock: 11,947 Genuine Part Fast Shipping
Preci-Dip 514-87-360M19-001148
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Key Specifications

Series 514
Package Bulk
Part Status Active
Type BGA
Number of Positions or Pins (Grid) 360 (19 x 19)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating Flash

Pricing

Quantity Unit Price (USD)
1+ $25.6701
21+ $25.6701
Active RoHS Compliant

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Technical Specifications

Series 514
Package Bulk
Part Status Active
Type BGA
Number of Positions or Pins (Grid) 360 (19 x 19)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating Flash
Contact Material - Mating Beryllium Copper
Mounting Type Surface Mount
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post -
Contact Material - Post Brass
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -55°C ~ 125°C

Product Description

The Preci-Dip 514-87-360M19-001148 is a CONN SOCKET BGA 360POS GOLD. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Surface Mount. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.

Key Specifications

  • Package: Bulk
  • Mounting Type: Surface Mount

Whether you need the Preci-Dip 514-87-360M19-001148 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.

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