BGA SOLDER TAIL
| Series | 550 |
| Package | Bulk |
| Part Status | Active |
| Type | BGA |
| Number of Positions or Pins (Grid) | 360 (19 x 19) |
| Pitch - Mating | 0.050" (1.27mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Quantity | Unit Price (USD) |
|---|---|
| 1+ | $33.1417 |
| 19+ | $33.1417 |
| Series | 550 |
| Package | Bulk |
| Part Status | Active |
| Type | BGA |
| Number of Positions or Pins (Grid) | 360 (19 x 19) |
| Pitch - Mating | 0.050" (1.27mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) |
| Contact Material - Mating | Brass |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.050" (1.27mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10.0µin (0.25µm) |
| Contact Material - Post | Brass |
| Housing Material | FR4 Epoxy Glass |
| Operating Temperature | -55°C ~ 125°C |
The Preci-Dip 550-10-360M19-001152 is a BGA SOLDER TAIL. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.
Whether you need the Preci-Dip 550-10-360M19-001152 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.