Name: Preci-Dip 550-10-360M19-001152
Brand: Preci-Dip
SKU: 550-10-360M19-001152
Price: 33.14174 USD
Availability: InStock

Technical Specifications

Series	550
Package	Bulk
Part Status	Active
Type	BGA
Number of Positions or Pins (Grid)	360 (19 x 19)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Brass
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

Product Description

The Preci-Dip 550-10-360M19-001152 is a BGA SOLDER TAIL. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Through Hole. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.

Key Specifications

Package: Bulk
Mounting Type: Through Hole

Whether you need the Preci-Dip 550-10-360M19-001152 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.