Name: Preci-Dip 558-10-360M19-001104
Brand: Preci-Dip
SKU: 558-10-360M19-001104
Price: 36.38934 USD
Availability: InStock

Technical Specifications

Series	558
Package	Bulk
Part Status	Active
Type	BGA
Number of Positions or Pins (Grid)	360 (19 x 19)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Brass
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

Product Description

The Preci-Dip 558-10-360M19-001104 is a BGA SURFACE MOUNT 1.27MM. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Surface Mount. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.

Key Specifications

Package: Bulk
Mounting Type: Surface Mount

Whether you need the Preci-Dip 558-10-360M19-001104 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.