Preci-Dip 558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

In Stock: 10,839 Genuine Part Fast Shipping
Preci-Dip 558-10-576M30-001104
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Key Specifications

Series 558
Package Bulk
Part Status Active
Type BGA
Number of Positions or Pins (Grid) 576 (30 x 30)
Pitch - Mating 0.050" (1.27mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)

Pricing

Quantity Unit Price (USD)
1+ $59.5668
13+ $59.5668
Active RoHS Compliant

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Technical Specifications

Series 558
Package Bulk
Part Status Active
Type BGA
Number of Positions or Pins (Grid) 576 (30 x 30)
Pitch - Mating 0.050" (1.27mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Brass
Mounting Type Surface Mount
Features Closed Frame
Termination Solder
Pitch - Post 0.050" (1.27mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Brass
Housing Material FR4 Epoxy Glass
Operating Temperature -55°C ~ 125°C

Product Description

The Preci-Dip 558-10-576M30-001104 is a BGA SURFACE MOUNT 1.27MM. This component belongs to the Sockets for ICs, Transistors category and features Package of Bulk, Mounting Type of Surface Mount. As an authorized distributor, SecureChip offers genuine Preci-Dip components with competitive pricing and fast delivery worldwide.

Key Specifications

  • Package: Bulk
  • Mounting Type: Surface Mount

Whether you need the Preci-Dip 558-10-576M30-001104 for prototype design, mass production, or maintenance and repair, our ample stock and technical support team ensure you receive the right components on time.

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