Foxconn Interconnect Technology (FIT) Limited focuses on the development, manufacturing, and marketing of electronic and optoelectronic transceivers, connectors, antennas, acoustic components, cables, and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products. With offices and manufacturing sites located in Asia, the Americas, and Europe, FIT is a global leader in the manufacturing of high precision interconnect components.

FIT is a leading supplier in Ethernet, Fibre Channel, and Proprietary Interconnect market segments and offers a broad portfolio of different products that include pluggable optical transceivers, embedded optical modules, cages and connectors, direct-attach copper cables, and active optical cables.

AFBR-825RH1Z

AFBR-825RH1Z

Foxconn OE Technologies

Description

MINIPOD 5G RX RND HEATSINK 100M

14,897

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AFBR-78D1SZ-ER1

AFBR-78D1SZ-ER1

Foxconn OE Technologies

Description

MICROPOD SUPER DEUCE RX 10G

16,357

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AFBR-815RN1Z

AFBR-815RN1Z

Foxconn OE Technologies

Description

MINIPOD TX ROUND NO HEATSINK

15,252

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AFBR-811FN3Z

AFBR-811FN3Z

Foxconn OE Technologies

Description

MINIPOD TX FLAT HEATSINK 300M

15,929

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AFBR-811FMZ

AFBR-811FMZ

Foxconn OE Technologies

Description

MINIPOD TX FLAT HEATSINK 100M

16,586

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AFBR-811FH1Z-CP1

AFBR-811FH1Z-CP1

Foxconn OE Technologies

Description

MINIPOD TX FLAT HEATSINK 100M

14,792

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AFBR-815RH1Z

AFBR-815RH1Z

Foxconn OE Technologies

Description

MINIPOD 5G TX RND HEATSINK 100M

14,702

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AFBR-811RMZ

AFBR-811RMZ

Foxconn OE Technologies

Description

12X10G TX ROUND CBL PKG MECH

15,292

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