Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W29GL512PL9T TR

W29GL512PL9T TR

Winbond Electronics Corporation

Description

IC FLASH 512MBIT PARALLEL 56TSOP

18,364

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W25Q512JVFIQ TR

W25Q512JVFIQ TR

Winbond Electronics Corporation

Description

IC FLASH 512MBIT SPI/QUAD 16SOIC

18,062

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W972GG6KB-25

W972GG6KB-25

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 84WBGA

14,517

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W25Q256JVBIM TR

W25Q256JVBIM TR

Winbond Electronics Corporation

Description

IC FLSH 256MBIT SPI/QUAD 24TFBGA

11,800

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W632GG8NB-12

W632GG8NB-12

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

18,405

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W25X10CLSNIG TR

W25X10CLSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 1MBIT SPI 104MHZ 8SOIC

32,253

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W25Q512JVBIM TR

W25Q512JVBIM TR

Winbond Electronics Corporation

Description

IC FLSH 512MBIT SPI/QUAD 24TFBGA

17,587

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W957D6HBCX7I TR

W957D6HBCX7I TR

Winbond Electronics Corporation

Description

IC PSRAM 128MBIT PAR 54VFBGA

18,751

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W632GU8NB-12

W632GU8NB-12

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

18,493

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W979H6KBVX2E

W979H6KBVX2E

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PAR 134VFBGA

17,237

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