Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W989D2DBJX6I

W989D2DBJX6I

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 90VFBGA

10,751

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W9425G6KH-5I

W9425G6KH-5I

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PAR 66TSOP II

13,741

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W979H2KBVX2E

W979H2KBVX2E

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PAR 134VFBGA

17,349

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W632GU6NB-12

W632GU6NB-12

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

18,483

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W972GG6KB25I

W972GG6KB25I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 84WBGA

14,719

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W25M02GVTBIG TR

W25M02GVTBIG TR

Winbond Electronics Corporation

Description

IC FLSH 2GBIT SPI 104MHZ 24TFBGA

18,980

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W25Q64JWZPIM TR

W25Q64JWZPIM TR

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8WSON

20,657

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W9812G6KH-5

W9812G6KH-5

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 54TSOP II

13,127

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W9816G6JH-6 TR

W9816G6JH-6 TR

Winbond Electronics Corporation

Description

IC DRAM 16MBIT PAR 50TSOP II

23,037

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W988D2FBJX7E

W988D2FBJX7E

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 90VFBGA

11,445

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