Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GU6KB-12 TR

W632GU6KB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96WBGA

16,263

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W632GU6KB11I

W632GU6KB11I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96WBGA

16,804

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W632GG6KB-15 TR

W632GG6KB-15 TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96WBGA

15,821

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W25Q16JVSSJQ TR

W25Q16JVSSJQ TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8SOIC

14,316

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W25Q64JVTCJQ TR

W25Q64JVTCJQ TR

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 24TFBGA

15,250

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W631GG6KS-12 TR

W631GG6KS-12 TR

Winbond Electronics Corporation

Description

IC SDRAM 1GBIT 96BGA

14,296

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W25Q16DVZPIG TR

W25Q16DVZPIG TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WSON

16,615

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W97BH6KBVX2E

W97BH6KBVX2E

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 134VFBGA

15,348

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W25X32VSFIG

W25X32VSFIG

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI 75MHZ 16SOIC

13,972

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W25X20VSNIG

W25X20VSNIG

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI 75MHZ 8SOIC

14,830

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