Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W631GG6MB15I

W631GG6MB15I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

17,167

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W9864G2JB-6

W9864G2JB-6

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PARALLEL 90TFBGA

18,927

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W25Q128JVFIM TR

W25Q128JVFIM TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 16SOIC

15,321

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W25Q80EWZPIG

W25Q80EWZPIG

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 104MHZ 8WSON

31,156

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W9816G6JH-5

W9816G6JH-5

Winbond Electronics Corporation

Description

IC DRAM 16MBIT PAR 50TSOP II

23,106

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W25Q16JWZPIQ

W25Q16JWZPIQ

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WSON

35,122

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W29GL512PH9T

W29GL512PH9T

Winbond Electronics Corporation

Description

IC FLASH 512MBIT PARALLEL 56TSOP

17,685

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W25Q20EWUXIE TR

W25Q20EWUXIE TR

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI 104MHZ 8USON

25,923

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W979H6KBVX2I

W979H6KBVX2I

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PAR 134VFBGA

17,307

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W9464G6KH-5 TR

W9464G6KH-5 TR

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PAR 66TSOP II

19,790

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