RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
B39212B8033P810

B39212B8033P810

RF360 - A Qualcomm-TDK joint venture

Description

RF DUPLEXER 1.7325/2.1325GHZ SMD

14,476

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B39881B8013P810

B39881B8013P810

RF360 - A Qualcomm-TDK joint venture

Description

RF DUPLEXER 836.5/881.5MHZ 9SMD

10,419

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B39791B8039P810

B39791B8039P810

RF360 - A Qualcomm-TDK joint venture

Description

RF DUPLEXER 9SMD NO LEAD

13,863

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B39311R884H210

B39311R884H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 310.0000MHZ SMD

15,886

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B39431R732U310

B39431R732U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.9600MHZ SMD

15,643

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B39921R2706U310

B39921R2706U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 915.0000MHZ SMD

16,826

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B39431R723U310

B39431R723U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 434.4200MHZ SMD

15,580

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B39431R800H210W3

B39431R800H210W3

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.9200MHZ SMD

15,652

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B39431R850H210

B39431R850H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.9400MHZ 2.7PF SMD

16,286

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B39421R853H210

B39421R853H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 423.2200MHZ SMD

16,350

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