RF360 - A Qualcomm-TDK joint venture offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
B39321R922H110

B39321R922H110

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 321.0000MHZ SMD

16,870

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B39431R715U310

B39431R715U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.3200MHZ SMD

15,738

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B39401R709U310

B39401R709U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 403.5500MHZ 3.7PF SMD

16,603

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B39421R2702U310

B39421R2702U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 418.0500MHZ SMD

16,548

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B39401R724U310

B39401R724U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 403.9660MHZ SMD

14,189

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B39301R734U310

B39301R734U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 304.3250MHZ SMD

14,728

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B39431R0962H110

B39431R0962H110

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 433.9500MHZ SMD

15,820

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B39321R883H210

B39321R883H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 315.1500MHZ SMD

15,031

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B39301R852H210

B39301R852H210

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 304.3000MHZ SMD

14,026

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B39311R2710U310

B39311R2710U310

RF360 - A Qualcomm-TDK joint venture

Description

SAW RES 311.0630MHZ 1.8PF SMD

15,890

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