Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GG6NB15I

W632GG6NB15I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

17,139

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W25Q32JWBYIQ TR

W25Q32JWBYIQ TR

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 12WLCSP

25,983

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W25Q16JLZPIG TR

W25Q16JLZPIG TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WSON

39,610

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W948D6KBHX5E TR

W948D6KBHX5E TR

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 60VFBGA

11,820

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W631GG6MB15I TR

W631GG6MB15I TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

19,940

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W25Q16JWZPIQ TR

W25Q16JWZPIQ TR

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WSON

40,927

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W25Q128JVFIQ

W25Q128JVFIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 16SOIC

11,862

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W25Q40CLSNIG TR

W25Q40CLSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 104MHZ 8SOIC

29,139

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W25Q80EWBYIG TR

W25Q80EWBYIG TR

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 104MHZ 8WLCSP

40,521

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W987D6HBGX6E

W987D6HBGX6E

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 54VFBGA

13,173

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