Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25X20CLSNIG

W25X20CLSNIG

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI 104MHZ 8SOIC

27,298

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W25Q80EWSSIG TR

W25Q80EWSSIG TR

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 104MHZ 8SOIC

22,372

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W9412G6KH-5 TR

W9412G6KH-5 TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 66TSOP II

13,512

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W9725G6KB-18 TR

W9725G6KB-18 TR

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 84WBGA

15,614

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W947D6HBHX6E TR

W947D6HBHX6E TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 60VFBGA

13,757

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W25Q16JWSNIM

W25Q16JWSNIM

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8SOIC

21,312

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W631GG6MB-15

W631GG6MB-15

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

18,385

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W631GG8MB-11 TR

W631GG8MB-11 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

11,302

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W25M02GVTCIG TR

W25M02GVTCIG TR

Winbond Electronics Corporation

Description

IC FLSH 2GBIT SPI 104MHZ 24TFBGA

19,119

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W9751G8NB-25

W9751G8NB-25

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 60VFBGA

11,181

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