Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GU6NB-11

W632GU6NB-11

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

18,331

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W29GL512SH9B TR

W29GL512SH9B TR

Winbond Electronics Corporation

Description

IC FLSH 512MBIT PARALLEL 64LFBGA

17,955

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W989D2DBJX6I TR

W989D2DBJX6I TR

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 90VFBGA

11,581

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W25X20CLSNIG TR

W25X20CLSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI 104MHZ 8SOIC

30,533

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W25X05CLSNIG TR

W25X05CLSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 512KBIT SPI 8SOIC

32,098

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W972GG8KB25I

W972GG8KB25I

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 84WBGA

14,770

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W25Q32JWZPIQ TR

W25Q32JWZPIQ TR

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8WSON

28,441

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W9816G6JH-6I

W9816G6JH-6I

Winbond Electronics Corporation

Description

IC DRAM 16MBIT PAR 50TSOP II

20,472

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W29N01HVSINA

W29N01HVSINA

Winbond Electronics Corporation

Description

IC FLASH 1GBIT PARALLEL 48TSOP

12,566

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W632GG8NB-15

W632GG8NB-15

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

18,436

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