Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25Q40EWSNIG TR

W25Q40EWSNIG TR

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 104MHZ 8SOIC

24,427

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W631GG6KB-12 TR

W631GG6KB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96WBGA

19,409

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W25Q32JVSTIQ

W25Q32JVSTIQ

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8VSOP

28,910

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W972GG6KB25I TR

W972GG6KB25I TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 84WBGA

15,207

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W9725G8KB-18

W9725G8KB-18

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 60WBGA

14,060

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W25Q256JVFIM

W25Q256JVFIM

Winbond Electronics Corporation

Description

IC FLASH 256MBIT SPI/QUAD 16SOIC

11,123

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W25Q128JWSIQ

W25Q128JWSIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8SOIC

14,457

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W25Q20EWBYIG TR

W25Q20EWBYIG TR

Winbond Electronics Corporation

Description

IC FLASH 2MBIT SPI/QUAD 8WLCSP

35,912

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W9725G6KB-18

W9725G6KB-18

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 84WBGA

13,931

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W631GG8MB-11

W631GG8MB-11

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

10,439

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