Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W987D2HBJX6E

W987D2HBJX6E

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 90VFBGA

13,085

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W25Q128JWPIM

W25Q128JWPIM

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

13,852

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W631GG8MB-12 TR

W631GG8MB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

11,400

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W25R128JVPIQ TR

W25R128JVPIQ TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

11,493

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W25Q32JVDAIQ

W25Q32JVDAIQ

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8DIP

21,010

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W9712G6KB25I TR

W9712G6KB25I TR

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 84TFBGA

15,085

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W25Q128JWFIQ

W25Q128JWFIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI 16SOIC

11,800

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W949D6DBHX5I

W949D6DBHX5I

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 60VFBGA

17,211

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W9812G6JB-6I

W9812G6JB-6I

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PARALLEL 54TFBGA

18,832

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W9864G6KH-6 TR

W9864G6KH-6 TR

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PAR 54TSOP II

19,014

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