Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25Q256JVCIM

W25Q256JVCIM

Winbond Electronics Corporation

Description

IC FLSH 256MBIT SPI/QUAD 24TFBGA

11,392

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W631GU8MB12I

W631GU8MB12I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 78VFBGA

18,908

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W25Q80DVZPIG TR

W25Q80DVZPIG TR

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 104MHZ 8WSON

23,772

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W94AD2KBJX5I

W94AD2KBJX5I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 90VFBGA

19,192

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W9751G6NB-25 TR

W9751G6NB-25 TR

Winbond Electronics Corporation

Description

IC DRAM 512MBIT PARALLEL 84VFBGA

15,516

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W971GG6SB25I TR

W971GG6SB25I TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 84WBGA

18,882

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W25X10CLSNIG

W25X10CLSNIG

Winbond Electronics Corporation

Description

IC FLASH 1MBIT SPI 104MHZ 8SOIC

35,667

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W631GU6MB-12 TR

W631GU6MB-12 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

11,766

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W631GU6MB-15 TR

W631GU6MB-15 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

11,833

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W25Q64JVSFIM TR

W25Q64JVSFIM TR

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 16SOIC

21,271

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