Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GG6KB15I TR

W632GG6KB15I TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96WBGA

14,443

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W25Q128FWPIF

W25Q128FWPIF

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

14,678

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W25X40AVSNIG

W25X40AVSNIG

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 100MHZ 8SOIC

16,591

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W632GU8KB-15

W632GU8KB-15

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78WBGA

14,034

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W25Q32BVSSJP TR

W25Q32BVSSJP TR

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 8SOIC

14,656

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W9864G6JT-6

W9864G6JT-6

Winbond Electronics Corporation

Description

IC DRAM 64MBIT PARALLEL 54TFBGA

16,660

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W631GU6KB11I

W631GU6KB11I

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96WBGA

13,949

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W25Q64FWSFIG

W25Q64FWSFIG

Winbond Electronics Corporation

Description

IC FLSH 64MBIT SPI 104MHZ 16SOIC

15,904

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W632GU8MB-09

W632GU8MB-09

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78VFBGA

14,297

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W25Q64JVXGJQ

W25Q64JVXGJQ

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8XSON

16,821

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