Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W25Q32FVTCIP TR

W25Q32FVTCIP TR

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 24TFBGA

15,904

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W74M12FVSSIQ TR

W74M12FVSSIQ TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8SOIC

14,801

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W948D6FBHX6G

W948D6FBHX6G

Winbond Electronics Corporation

Description

IC DRAM 256MBIT PARALLEL 60VFBGA

14,501

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W632GU6MB-09

W632GU6MB-09

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

16,298

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W25Q128JVPJQ TR

W25Q128JVPJQ TR

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

14,363

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W25Q80BLZPIG

W25Q80BLZPIG

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 80MHZ 8WSON

16,534

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W25Q128FWPIQ

W25Q128FWPIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8WSON

16,794

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W25Q32JVSFJQ

W25Q32JVSFJQ

Winbond Electronics Corporation

Description

IC FLASH 32MBIT SPI/QUAD 16SOIC

15,250

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W25Q64DWSFIG

W25Q64DWSFIG

Winbond Electronics Corporation

Description

IC FLSH 64MBIT SPI 104MHZ 16SOIC

14,687

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W9412G6IH-5

W9412G6IH-5

Winbond Electronics Corporation

Description

IC DRAM 128MBIT PAR 66TSOP II

15,057

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