Winbond Electronics Corporation is a memory IC company engaged in design, manufacturing and sales service to provide its global customers top quality memory solutions. Winbond’s product lines include Code Storage Flash Memory, Serial and Parallel NAND, Specialty DRAM and Mobile DRAM.

Winbond products are widely used by companies in the IoT vertical markets such as computing, connected multimedia devices, automobile, networking systems and industrial. Winbond offers automotive and Industrial –Plus grade Flash and DRAM products with longevity support. Winbond has approximately 2,200 employees worldwide, that includes a 12-inch FAB at its headquarters in Taichung, Taiwan.

W632GG6NB15J

W632GG6NB15J

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 96VFBGA

16,147

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W632GU8KB-15 TR

W632GU8KB-15 TR

Winbond Electronics Corporation

Description

IC DRAM 2GBIT PARALLEL 78WBGA

14,349

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W631GU6KS-12 TR

W631GU6KS-12 TR

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96VFBGA

14,096

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W25X40BVSNIG

W25X40BVSNIG

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 104MHZ 8SOIC

14,676

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W25Q16JWBYIM

W25Q16JWBYIM

Winbond Electronics Corporation

Description

IC FLASH 16MBIT SPI/QUAD 8WLCSP

15,887

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W25Q40BWSSIG TR

W25Q40BWSSIG TR

Winbond Electronics Corporation

Description

IC FLASH 4MBIT SPI 80MHZ 8SOIC

16,345

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W25P80VSSIG

W25P80VSSIG

Winbond Electronics Corporation

Description

IC FLASH 8MBIT SPI 50MHZ 8SOIC

14,862

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W25R128FVSIQ

W25R128FVSIQ

Winbond Electronics Corporation

Description

IC FLASH 128MBIT SPI/QUAD 8SOIC

14,511

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W631GG6KB12J

W631GG6KB12J

Winbond Electronics Corporation

Description

IC DRAM 1GBIT PARALLEL 96WBGA

16,339

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W25Q64FVSTIG

W25Q64FVSTIG

Winbond Electronics Corporation

Description

IC FLASH 64MBIT SPI/QUAD 8VSOP

14,475

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